Home > Products & Markets > Copper-clad Laminate
Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
Mid-loss
Low-loss
Very Low-loss
Ultra Low-loss
Extreme Low-loss
Specification value
Product list
No. Product series Product name Product brief description Dk@10GHz Df@10GHz
1 Very Low-loss H360 超低介质损耗，低介电常数，高耐热材料 3.65 0.0048
2 Very Low-loss H190HF 超低介质损耗，低介电常数，高耐热无卤材料 3.85 0.0052
3 Very Low-loss H360(Z) 超低介质损耗，低介电常数，高耐热材料 3.65 0.0045