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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
Mid-loss
Low-loss
Very Low-loss
Ultra Low-loss
Extreme Low-loss
Specification value
Product list
No. Product series Product name Product brief description Dk@10GHz Df@10GHz
1 Mid-loss H175HF 中等介质损耗，高耐热无卤材料 4.0 0.012
2 Mid-loss H175HFZ 中等介质损耗，高耐热无卤材料 4.0 0.010
3 Low-loss H180HF 低介质损耗，高耐热无卤材料 3.9 0.007
4 Low-loss H185HF 低介质损耗，高耐热无卤材料 3.9 0.007
5 Very Low-loss H360 超低介质损耗，低介电常数，高耐热材料 3.65 0.0048
6 Very Low-loss H190HF 超低介质损耗，低介电常数，高耐热无卤材料 3.85 0.0052
7 Very Low-loss H360(Z) 超低介质损耗，低介电常数，高耐热材料 3.65 0.0045
8 Ultra Low-loss HSD7 超低介质损耗，低介电常数，高耐热材料 3.53 0.004
9 Ultra Low-loss HSD7(K) 超低介质损耗，低介电常数，高耐热材料 3.37 0.0021
10 Ultra Low-loss HSD7JA(K) 超低介质损耗，低介电常数，高耐热材料 3.16 0.0018
11 Ultra Low-loss H350 超低介质损耗，低介电常数，低膨胀高耐热材料 3.53 0.0039
12 Ultra Low-loss H350(K) 超低介质损耗，低介电常数，低膨胀高耐热材料 3.37 0.002
13 Ultra Low-loss HSD7LG
14 Extreme Low-loss HSD8 极低介质损耗，低介电常数，低膨胀高耐热材料 3.15 0.0012
15 Ultra Low-loss HSD7LG(K)
16 Extreme Low-loss HSD8(K) 极低介质损耗，低介电常数，低膨胀高耐热材料 3.25 0.0014