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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
封装基板类BT
封装基板BT
Product list
No. Product series Product name Product brief description Tg(℃) CTE 模量
1 封装基板类BT HW20-M1 白色类BT ≥210 13-15 23
2 封装基板类BT HW20-M2 白色类BT ≥180 13-15 23
3 封装基板类BT HB20-M2 黑色类BT ≥195 13-15 23
4 封装基板类BT HW20-M2(TC)
5 封装基板BT HB20-M1 黑色BT ≥230 11-13 28