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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
Mid-loss
Low-loss
Very Low-loss
Ultra Low-loss
Extreme Low-loss
Specification value
Product list
No. Product series Product name Product brief description Dk@10GHz Df@10GHz
1 Low-loss H180HF 低介质损耗，高耐热无卤材料 3.9 0.007
2 Low-loss H185HF 低介质损耗，高耐热无卤材料 3.9 0.007