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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
Lead Free
Halogen Free
Specification value
Product list
No. Product series Product name Product brief description Tg(℃) Td(℃)
1 Halogen Free H151HF Middle-Tg无卤、普通电性 153 360
2 Halogen Free H170GR High-Tg无卤、Low Dk/Df 180 385