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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
铝基板
铜基板
导热FR-4
Specification value
Product list
No. Product series Product name Product brief description Tg(℃) MOT(℃)
1 铜基板 HC88 应用范围：汽车照明，电源工控，特种照明，功率半导体 ≥150 150