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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
封装基板类BT
封装基板BT
Product list
No. Product series Product name Product brief description Tg(℃) CTE 模量
1 封装基板BT HB20-M1 黑色BT ≥230 11-13 28