Home > Products & Markets > Copper-clad Laminate
Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
铝基板
铜基板
导热FR-4
Specification value
Product list
No. Product series Product name Product brief description Tg(℃) MOT(℃)
  • Empty data.