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Copper-clad Laminate
COPPER CLAD LAMINATES
Basic material
High-frequency material
High speed material
Heat-conducting material
Semiconductor material
HDI material
CBF material
Product series
All
Mid-loss
Low-loss
Very Low-loss
Ultra Low-loss
Extreme Low-loss
Specification value
Product list
No. Product series Product name Product brief description Dk@10GHz Df@10GHz
1 Extreme Low-loss HSD8 极低介质损耗，低介电常数，低膨胀高耐热材料 3.15 0.0012
2 Extreme Low-loss HSD8(K) 极低介质损耗，低介电常数，低膨胀高耐热材料 3.25 0.0014