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H2135
2017-11-22

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特性/ Features

Tg:135±5℃ (DSC)

UV Blocking与 AOI兼容可提高PCB生产效率 

UV Blocking and AOI compatible,so as to increase productivity efficiency

可依需求提供不具UV阻挡功能的自然色板材(白料)/No UV Blocking and natural color CCL upon request可依需求提介电常数为:4.3±0.3 (1 MHZ)的FR-4板材

According to necessity to provide a dielectric constant: 4.3 ± 0.3 (1 MHZ) of FR-4 plate


主要特性 / General properties

检测项目Item单位Unit检测条件Test Condition规范值Spec典型值Typical Value
玻璃化转变温度 TgDSC135±5135.5
剥离强度 1oz Peel StrengthN/mm288℃, 10S≥1.401.81
热应力 Thermal stressS288℃,solder dip>10120 s No delamination
弯曲强度 Flexural StrengthN/mm2经向 LW≥415580
纬向CW≥345485
燃烧性 Flammability-E 24/125UL94V-0UL94V-0
表面电阻 Surface ResistivityAfter moisture≥1.0×1045.16×107
体积电阻 Volume ResistivityMΩ·cmAfter moisture≥1.0×1065.07×108
介电常数 Dielectric Constan-1 MHZ    C 24/23/50≤5.44.8
介质损耗角正切 Loss Tangent-1 MHZ    C 24/23/50≤0.035125
耐电弧 Arc ResistanceSD48/50+D0.5/23≥605.07×108
击穿电压 Dielectric  BreakdownKVD48/50+D0.5/23≥4058
吸水率 Moisture Absorption%D24/23≤0.350.15
热分解温度 TdWeight Loss 5%-310
CTEZ-axisAlpha 1ppm / ℃TMA-60
Alpha 2ppm / ℃-300
50 - 260 ℃%-4.3
T288minTMA-2
相比漏电起痕指数 CTIVIEC-60112175~250200


应用领域/ Applications

适合于2-6层PCB、计算机及外围设备、通讯设备、办公自动设备等。

Suitable for medium multilayer printed circuit board, computer, communication equipment, OA equipment, etc.


产品系列 / Purchasing information 

板材规格:

厚度Thickness

铜箔Copper foil

标准尺寸 Standard size

0.10~3.2mm 

12um ~ 105um

37"×49"41"×49"43"×49"

※ Other sheet size and thickness could be available upon request 


半固化片介绍/ Prepreg instruction 

prepreg type

Resin Content(%)

Gel Time (sec/171℃) 胶化时间

Resin Flow  流动度

压合厚度Cured thickness(mm/mil)

R/C(%)     含量

Tolerance公差

Nominal

Range(±)mil

%

±

S

%

mm

mil

mm