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Thermal conductive prepreg HA10P

半固化片   / Prepreg

导热系数

Thermal   Conductivity

规格

Specification

压合厚度   / Cured thickness

流动度   / Resin Flow

um

%

1W/m.K

1080

80 ± 10

20 ± 10

100 ± 10

30 ± 10

可根据需求,提供其他厚度的粘结片 / We are also   able to supply HA10P with other thickness.


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