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H1170(黑)

FEATURES

Tg: ≥170ºC (DSC)

Excellent Anti-CAF resistance

Excellent T/H reliability

High Thermal Performance

Excellent in Dimension Stability

Excellent in Thickness Uniformity

Excellent in Refractive index and Color consistency


APPLICATIONS

Mini/Micro LED Dispiay

Computer

Communication Equipment

Automotive


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Tg

DSC

≧170

173

Peel Strength 1oz

288℃,10S

N/mm

1.05

1.20

Thermal stress

288℃,solder dip

6

>10

180s No delamination

Flexural Strength

Warp

N/mm2

≧415

579

Fill

≧345

490

Flammability

E 24/125

UL94V-0

V-0

Surface Resistivity

After moisture

≧1.0x104

1.99x105

Volume Resistivity

After moisture

MΩ·cm

≧1.0x106

5.92x109

Arc Resistance

D 48/50+D 0.5/23

S

≧60

180

Moisture Absorption

D 24/23

%

≦0.35

0.12

Td

Weight Loss 5%

≧340

340

CTE in XY/Z Axis

Alpha 1

TMA

ppm /

≦60

45

Alpha 2

ppm /

≦300

250

50-260

%

≦3.0

2.10

T288(Unclad)

TMA

Min

≧5

30

T300(Unclad)

TMA

Min

NA

5

 

u  Specimen thickness: 1.6mm

u  Specification sheet: IPC-4101E/126 is for your reference only.

u  Explanation: C: Humidity conditioning

   D: Immersion conditioning distilled water.

   E: Temperature conditioning